Career
1. Papers and books published in academic journals (including bulletins and journals)
【1-1】Hua, J., Furukawa, M. & Maeda, T. Extrapolation of Thermal Sensation: Warm‑cold Stimulus Pair Elicits a Sense of Warmth Outside the Stimulus. IEEE Access, 61681–61696 (2024).
2. Explanations and reviews in academic and commercial magazines
none
3. Presentation at an international conference
【3-1】Hua, J., Furukawa, M. & Maeda, T. The Central Mechanism Underlying Extrapolation of Thermal Sensation in International AsiaHaptics conference (2022), 105–120.
【3-2】Hua, J., Furukawa, M. & Maeda, T. Extrapolation of Thermal Sensation and A Neuron‑Like Model Based on Distribution Difference and Interactions of Thermoreceptors in 2021 IEEE World Haptics Conference (WHC) (2021), 43–48.
4. Presentations at domestic academic conferences and symposiums
【4-1】Hua, J., Zheng, W & Shen, J. Fireball Launch Experience Using a Flexible Thermal Sensation Device. Entertainment Computing Symposium 2019, 383–385 (2019).
5. Patent etc.
none